Metal CMP and brush cleaner
Metal CMP and brush cleaner THE OBJECT OF THE PROCUREMENT The procurement concerned the delivery of an automatic metal Chemical Mechanical Polishing (CMP) system with an integrated wafer cleaner for processing and planarization of 200 mm semiconductor wafers. The scope included the fully configured CMP tool, integrated cleaning unit, required accessories, and delivery, installation, and commissioning. Tool was acquired for processing of following applications: 1. Copper and barrier polishing steps for a. Integrated passive components b. CMOS wafers Back-End-of-the-Line (BEOL) and Mid-End…
- Ostaja
- TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
- Julkaistu
- 2026-11-11
- Arvo
- 4 148 000 USD
- Ilmoitus
- 61659
Voittajat ja hankinnan osat
Metal CMP and brush cleaner
THE OBJECT OF THE PROCUREMENT The procurement concerned the delivery of an automatic metal Chemical Mechanical Polishing (CMP) system with an integrated wafer cleaner for processing and planarization of 200 mm semiconductor wafers. The scope included the fully configured CMP tool, integrated cleaning unit, required accessories, and delivery, installation, and commissioning. Tool was acquired for processing of following applications: 1. Copper and barrier polishing steps for a. Integrated p…
- Applied Materials South East Asia Pte Ltd (3501933-4) – 4 148 000 €