Wafer metrology
Wafer metrology The object of the tender was semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool had to be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process was described in more detail in the invitat…
- Ostaja
- VTT Technical Research Centre of Finland Ltd
- Julkaistu
- 2026-08-30
- Arvo
- 464 674 EUR
- Suorituspaikka
- Uusimaa
- Ilmoitus
- 55812
Voittajat ja hankinnan osat
Wafer metrology
The object of the tender was semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool had to be compatible with installation in an ISO 4 classified clean…
- FRT GmbH (95573138) – 464 674 €