Semi-Automatic Wafer Grinder
Semi-Automatic Wafer Grinder The object of the tender was a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capability to grind only a determined distance from edge-to-center. Equipment had to be new. The tool had to comply with cleanroom equipment standard safety and contamination requ…
- Ostaja
- VTT Technical Research Centre of Finland Ltd
- Julkaistu
- 2026-02-12
- Arvo
- 325 000 EUR
- Suorituspaikka
- Uusimaa
- Ilmoitus
- 40675
Voittajat ja hankinnan osat
Semi-Automatic Wafer Grinder
The object of the tender was a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capability to grind only a determined distance from edge-to-center. Equipment had to be new. The tool had to…
- DISCO HI-TEC EUROPE GmbH (DE131174016) – 325 000 €